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Samsung Semiconductor - K4B2G1646F-BFMA

KEY Part #: K7359660

[21119pcs Stock]

    Part Number:
    K4B2G1646F-BFMA
    Manufacturer:
    Samsung Semiconductor
    Detailed description:
    2 Gb 128M x 16 1866 Mbps 1.35 V -40 ~ 95 °C 96FBGA Mass Production.
    Manufacturer's standard lead time:
    In stock
    Shelf life:
    One Year
    Chip From:
    Hong Kong
    RoHS:
    Payment method:
    Shipment way:
    Family Categories:
    KEY Components Co.,LTD is a Electronic Components Distributor who offers product categories including : SLC Nand, LPDDR5, HBM Aquabolt, HBM Flarebolt, LPDDR4X, DDR4, LPDDR3 and GDDR6 ...
    Competitive Advantage:
    We specialize in Samsung Semiconductor K4B2G1646F-BFMA electronic components. K4B2G1646F-BFMA can be shipped within 24 hours after order. If you have any demands for K4B2G1646F-BFMA, Please submit a Request for Quotation here or send us an email:
    GB-T-27922
    ISO-9001-2015
    ISO-13485
    ISO-14001
    ISO-28000-2007
    ISO-45001-2018

    K4B2G1646F-BFMA Product Attributes

    Part Number : K4B2G1646F-BFMA
    Manufacturer : Samsung Semiconductor
    Description : 2 Gb 128M x 16 1866 Mbps 1.35 V -40 ~ 95 °C 96FBGA Mass Production
    Series : DDR3

    Latest News

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    5G and Memory - from Connected Thinking to Connected Living
    Mass Production of Fifth-Generation V-NAND has Started
    Samsung Rolls Out Industry’s First 8GB LPDDR4 DRAM Package
    The future of NAND technology
    Samsung Honored for Outstanding Design and Engineering with 36 CES 2018 Innovation Awards
    SSDs, DRAM and gaming: Unlocking a new level of performance
    Samsung’s Newest ISOCELL Image Sensor Enables Mobile Devices to ‘Slow Down’ Time
    Samsung’s PM1733 SSD and High Density DIMMs Support AMD EPYC™ 7002 Series Processor
    Samsung Announces Production of Industry’s First 2GB LPDDR3 Mobile Memory, Using 30nm-class Technology
    Automotive Driven by Small Packages Under the Hood
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